Chemical Mechanical Planarization (CMP) plays a vital role in the fabrication of integrated circuits. It combines chemical reactions and mechanical polishing techniques to achieve an even and smooth surface on silicon wafers.

With the rapid advances in IC manufacturing processes, the flatness and uniformity of the chip's topography during various manufacturing stages are critical for the yield and product performance. This impact is further magnified when the microchip's process layers are stacked up and process-sensitive patterns exist on the chip's layout. One of the significant challenges in securing high chip yield is to achieve accurate simulation, modeling, and optimization of the CMP process and its effect on the chip's topography. To overcome this challenge, Semitronix offers CMPEXP, a tool that can ensure the manufacturability of chips and yield.